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42.3.4.3 Reporting the Results mN or mN/mm. The output from a wetting balance is typically a force measurement. The force value in and of itself does not help interpret how good or bad the test specimen is, but obviously, the higher the force the better. The size of the test specimen and the wettable length of the specimen are key characteristics in how much force is produced, and the buoyancy of the device also is a key characteristic. To rationalize solderability performance over a myriad of components and PCB thicknesses, the use of normalized data is recommended. The wetting force is then reported as mN/mm and the ability to standardize on minimum acceptable values regardless of part size is now possible. Some wetting balance software does this normalization automatically, but other software that doesn t will need to be manipulated by exporting to Excel(tm) or similar programs to normalize the output data. .net data matrix barcode generator DataMatrix . net / Discussion / Help:Encoding and Decoding GS1 ...
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Find out most popular NuGet datamatrix Packages. ... NET SDK - the professional . NET barcode reader and generator SDK for developers. It supports reading ... The test temperatures specified for solderability testing with SnPb is 235 C and 245 C for PCBs and components respectively. The test temperature for SAC305 testing should be 255 C for both the component and PCB solderability specifications. Testing at lower temperatures will produce slower wetting times that maybe reported as failures incorrectly. As the temperature increases, there is the possibility of the thermal degradation of the flux being used for the test, but unfortunately not everyone follows the recommendations of the solderability specifications. If this occurs, a false negative result may be obtained check with the flux supplier before using temperatures above 260 C for testing regarding the stability of the flux. Figure 42.7 is a comparison of average wetting times for ENIG, tested at 235 C as a function of solder alloy used. The SnPb alloy wet the coupon after 0.75 seconds, SAC305 took more than 4 seconds and SnCu did not wet during the 10 seconds of the test. datamatrix net documentation, .net qr code reader, java error code 128, crystal reports gs1 128, asp.net code 128 reader, java qr code reader example vb.net data matrix code Best 20 NuGet datamatrix Packages - NuGet Must Haves Package
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BizCode Generator for . NET Ultimate is professional barcode generating component, allowing Data Matrix and other 20+ linear & 2D barcodes to be generated ... Solderability testing results should be useable in process development. The classic dip and look tests produce only go/no go data that has little value in troubleshooting or developing a plating line. It cannot differentiate if one pre-clean chemistry is better than another or the effect of the micro-etch rate on basis metal removal because it does not produce useable data. The part tested by dip and look is immersed into the solder bath and it either wets or it doesn t wet with no shades of gray in between. Solderability testing with a wetting balance can detect subtle changes in many of the process steps that are part of the plating process of a PCB or a component. The shape of the curve and the rate of rise give the informed user the vital information necessary to troubleshoot or refine their process. A slow rise of the wetting curve is indicative of oxides. That is, is the rinsing too aggressive, the pH too low, or the temperature too high Initial good wetting, followed by low forces being produced, indicates poor surface preparation of the basis metal. Is the micro-etch able to attack the basis metal or is the preclean leaving a barrier film that prevents it from doing its work Table 42.3 details some of the powers of a useable solderability test (as compared to a dip and look test) for the process of an immersion chemistry such as tin or silver. It is assumed that the process is in control and all process sequence steps are being followed. TABLE 42.3 Comparison of the Power of a Wetting Balance Test to a Dip and Look Test for Process Development I Sn or I Ag Process Flow and Solderability Testing Process step Acid Preclean Rinse Microetch Rinse Pre-dip I Sn or I Ag plating Rinsing (too short, too long, too much oxygen, incorrect pH) Drying ( leaving parts wet or over-drying) Dip and look testing Changes in chemistry not detectable Changes in chemistry not detectable Changes in chemistry not detectable Changes in chemistry not detectable Changes in chemistry not detectable Not detectable Wetting balance Changes in chemistry detectable Changes in chemistry detectable Changes in chemistry detectable Changes in chemistry detectable Changes in chemistry detectable Detectable datamatrix net documentation VB . NET Data Matrix Generator generate, create 2D barcode Data ...
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