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Precision component manufacturing increasingly requires specifying tolerances on some component features that are so rigid that mere shop floor or operation-induced temperature changes can cause measured dimensions to vary significantly Dimensions are usually specified at 20 C because ISO1 fixes the standard reference temperature for industrial length measurements at 20 C A workpiece or gauge departing from this temperature by even a few degrees can result in unexpected changes in critical dimensions For example, a gauge that reads 7533 mm, say, 30 times in succession while measuring a 7520 mm diameter will have a remarkable repeatability precision but will not give accurate readings It then becomes necessary to make a compensation for deviations from the reference temperature (20 C) as environmental conditions can also affect precision measurements

Testing with a wetting balance will provide the following information: 1. The speed of wetting This will show how solderable the part is. This will show if the part is old, how well or poorly the part has been stored, and/or how well the process control is for the plating process. 2. The rate of rise to maximum wetting force This will show the level of oxides present on the surface in the case of a gold-plated part, and how thick the deposit is. This again will provide information on process control and/or age and storage of the parts being tested. 3. The maximum wetting force produced The higher the force the better provides information on the basis metal solderability, the surface preparation, or lack thereof. Low forces recorded on a test, even if the wetting time is fast, is of major concern. 4. Once the part wets and produces positive wetting forces, do they remain consistent (ideal), continue to increase (indicative of oxide reduction), or begin to de-wet (the worst

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solder over the pads and the hole walls. The operation sounds simple, but it requires constant fine-tuning and maintenance of the hot-air solder coater leveler; otherwise, some holes may become heavily clogged with solder and are then useless for component insertion. One advantage of the pattern-plating method over the panel-plating method is in etching. The pattern-plating method needs to etch only the base copper. The use of ultrathin copper foil (UTC), which is usually 1 8 or 1 4 oz thick, offers a real advantage. However, as long as electroplating is used, the pattern-plating method cannot escape from a current distribution problem, regardless of the thickness of the base foils. The panel-plating method by electroplating suffers from the same problem but to a lesser degree. Good current distribution is very difficult to achieve when the boards are not of the same size or type, and particularly if some have large ground planes on the outer faces being plated. When the board has a few holes in an isolated area remote from the bulk of the circuitry, these tend to become overplated, making component lead insertion difficult during assembly. To minimize this current distribution problem, various countermeasures are practiced, such as special anode position, anode masking, agitation, and plating thieves. But none of these offers a decisive solution to the distribution problem, and they are extremely difficult to implement flexibly and effectively in a large plating operation, where a large number of product mixes have to be handled all the time.

Another advantage of the pattern-plating method is its ability to form padless micro-via holes of a diameter ranging from 0.012 to 0.016 in. Micro-via holes enable better usage of conductor channels, thereby increasing the connective capacity of the board. 5.8.3 Panel Plating In the panel-plating method, there are two variations for finishing the board after the panel is plated with electrolytic copper to the desired thickness. In the hole-plugging method, the holes are filled with alkaline-etchable ink to protect the hole walls from being etched; this is used in conjunction with screened etch resist. In the other method, called tent-and-etch or simply tenting, the copper in the hole is protected from etching by covering the hole or tenting with dry film, which is also used as an etch resist for conductors on the panel surface. The simplified sequence of the panel-plating method is as follows (see Fig. 5.6): 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Catalyzing Thin electroless copper deposition (0.0001 in) Electroplating copper (0.001 to 0.0012 in) Hole plugging with alkaline-resolvable ink; tenting (dry film lamination) Screen-print etching resist (conductor pattern); photoexpose the panel for conductor pattern Etching copper Stripping etching resist Solder mask Solder coater leveler (optional) Final fabrication and inspection

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